Advanced Package Technology, Principal Engineer

Data Infrastructure, Package Design, High Performance Computing, Export Controls, 3D, Network Design, Department of State, Design Systems, Artificial Intelligence, ANSYS, Networking Technologies, Product Design, Supply Chain Management, Power Analysis, Level Design, Department of Commerce, Packaging, Licensing, Optics, Characterization, Interviews, Signal Integrity, PCB design, Industrial Design, Data Center, Strategic Partnerships, POC, Feasibility Studies